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GS81302S08 Datasheet, PDF (6/35 Pages) GSI Technology – 144Mb SigmaSIOTM DDR -II Burst of 2 SRAM
GS81302S08/09/18/36E-375/350/333/300/250
Pin Description Table
Symbol
Description
Type
Comments
SA
Synchronous Address Inputs
Input
—
R/W
Read/Write Contol Pin
Input
Write Active Low; Read Active High
NW0–NW1
Synchronous Nybble Writes
Input
Active Low
x08 Version
BW0–BW1
Synchronous Byte Writes
Input
Active Low
x18 Version
BW0–BW3
Synchronous Byte Writes
Input
Active Low
x36 Version
K
Input Clock
Input
Active High
C
Output Clock
Input
Active High
TMS
Test Mode Select
Input
—
TDI
Test Data Input
Input
—
TCK
Test Clock Input
Input
—
TDO
Test Data Output
Output
—
VREF
HSTL Input Reference Voltage
Input
—
ZQ
Output Impedance Matching Input
Input
—
K
Input Clock
Input
Active Low
C
Output Clock
Output
Active Low
DOFF
DLL Disable
—
Active Low
LD
Synchronous Load Pin
—
Active Low
CQ
Output Echo Clock
Output
Active Low
CQ
Output Echo Clock
Output
Active High
Dn
Synchronous Data Inputs
Input
—
Qn
Synchronous Data Outputs
Output
—
VDD
Power Supply
Supply
1.8 V Nominal
VDDQ
Isolated Output Buffer Supply
Supply
1.8 or 1.5 V Nominal
VSS
Power Supply: Ground
Supply
—
NC
No Connect
—
—
Notes:
1. C, C, K, or K cannot be set to VREF voltage.
2. When ZQ pin is directly connected to VDDQ, output impedance is set to minimum value and it cannot be connected to ground or left
unconnected.
3. NC = Not Connected to die or any other pin
Rev: 1.03b 12/2011
6/35
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2011, GSI Technology