GS81302S08 Datasheet, PDF (15/35 Pages) GSI Technology – 144Mb SigmaSIOTM DDR -II Burst of 2 SRAM

GS81302S08/09/18/36E-375/350/333/300/250
Thermal Impedance
Package
Test PCB
Substrate
θ JA (C°/W)
Airflow = 0 m/s
θ JA (C°/W)
Airflow = 1 m/s
θ JA (C°/W)
Airflow = 2 m/s
θ JB (C°/W) θ JC (C°/W)
165 BGA
4-layer
16.4
13.4
12.4
8.6
1.2
Notes:
1. Thermal Impedance data is based on a number of of samples from mulitple lots and should be viewed as a typical number.
2. Please refer to JEDEC standard JESD51-6.
3. The characteristics of the test fixture PCB influence reported thermal characteristics of the device. Be advised that a good thermal path to
the PCB can result in cooling or heating of the RAM depending on PCB temperature.
HSTL I/O DC Input Characteristics
Parameter
DC Input Logic High
DC Input Logic Low
Note:
Compatible with both 1.8 V and 1.5 V I/O drivers
Symbol
V_IH (dc)
V_IL (dc)
Min
V_REF + 0.1
–0.3
Max
V_DDQ + 0.3
V_REF – 0.1
Units
mV
mV
HSTL I/O AC Input Characteristics
Parameter
Symbol
Min
Max
Units
AC Input Logic High
V_IH (ac)
V_REF + 0.2
—
mV
AC Input Logic Low
V_IL (ac)
—
V_REF – 0.2
mV
V_REF Peak- to-Peak AC Voltage
V_REF (ac)
—
5% V_REF (DC)
mV
Notes:
1. The peak-to-peak AC component superimposed on V_REF may not exceed 5% of the DC component of V_REF..
2. To guarantee AC characteristics, V_IH,V_IL, Trise, and Tfall of inputs and clocks must be within 10% of each other.
3. For devices supplied with HSTL I/O input buffers. Compatible with both 1.8 V and 1.5 V I/O drivers.
Notes
1
1
Notes
2,3
2,3
1
Undershoot Measurement and Timing
V_IH
V_SS
50%
V_SS – 1.0 V
20% tKHKH
Overshoot Measurement and Timing
V_DD + 1.0 V
50%
20% tKHKH
V_DD
V_IL
Rev: 1.03b 12/2011
15/35
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2011, GSI Technology