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GS8170LW36AC Datasheet, PDF (29/32 Pages) GSI Technology – 18Mb Σ1x1Lp CMOS I/O Late Write SigmaRAM | |||
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A
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GS8170LW36/72AC-350/333/300/250
209 BGA Package Drawing (Package C)
14 mm x 22 mm Body, 1.0 mm Bump Pitch, 11 x 19 Bump Array
C A1
Side View
D
D1
e
Bottom View
â
b
e
Symbol
Min
Typ
Max Units Symbol
Min
Typ
Max
Units
A
â
â
1.70
mm
D1
â
18.0 (BSC)
â
mm
A1
0.40
0.50
0.60
mm
E
13.9
14.0
14.1
mm
â
b
0.50
0.60
0.70
mm
E1
â
10.0 (BSC)
â
mm
c
0.31
0.36
0.38
mm
e
â
1.00 (BSC)
â
mm
D
21.9
22.0
22.1
mm
aaa
â
0.15
â
mm
Rev 1.0
Rev: 1.04 4/2005
29/32
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2003, GSI Technology
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