GS816018 Datasheet, PDF (24/28 Pages) GSI Technology – 1M x 18, 512K x 32, 512K x 36 18Mb Sync Burst SRAMs

Preliminary
GS816018/32/36T-250/225/200/166/150/133
TQFP Package Drawing
Symbol
Description
Min. Nom. Max
θ
L
L1
c
A1
Standoff
0.05 0.10 0.15
A2
Body Thickness 1.35 1.40 1.45
b
Lead Width
0.20 0.30 0.40
c
Lead Thickness 0.09 — 0.20
D
Terminal Dimension 21.9 22.0 22.1
e
D1
Package Body 19.9 20.0 20.1
E
Terminal Dimension 15.9 16.0 16.1
b
E1
Package Body 13.9 14.0 14.1
e
Lead Pitch
— 0.65 —
L
Foot Length
0.45 0.60 0.75
L1
Lead Length
— 1.00 —
A1
Y
Coplanarity
0.10
A2
E1
θ
Lead Angle
0°
—
7°
E
Notes:
1. All dimensions are in millimeters (mm).
2. Package width and length do not include mold protrusion.
Rev: 2.12 3/2002
24/28
© 1999, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.