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GS8182Q36BGD-167 Datasheet, PDF (21/36 Pages) GSI Technology – 18Mb SigmaQuad-IITM Burst of 2 SRAM
GS8182Q08/09/18/36BD-333/300/250/200/167/133
AC Electrical Characteristics (Continued)
Parameter
Symbol
-333
Min Max
-300
Min Max
-250
Min Max
-200
Min Max
-167
Min Max
-133
Min Max
Hold Times
Address Input Hold Time
tKHAX
0.28 —
0.3
— 0.35 —
0.4
—
0.5
—
0.5
— ns 1
Control Input Hold Time (RW, LD)
tKHIX
0.28 —
0.3
— 0.35 —
0.4
—
0.5
—
0.5
— ns 2
Control Input Hold Time (BWX, NWX)
tIVKH
0.28 —
0.3
— 0.35 —
0.4
—
0.5
—
0.5
— ns 3
Data Input Hold Time
tKHDX
0.28 —
0.3
— 0.35 —
0.4
—
0.5
—
0.5
— ns
Notes:
1. All Address inputs must meet the specified setup and hold times for all latching clock edges.
2. Control singles are RW, LD.
3. Control singles BW0, BW1, (NW0, NW1 for x8) and BW2, BW3 for x36.
4. If C, C are tied high, K, K become the references for C, C timing parameters
5. To avoid bus contention, at a given voltage and temperature tCHQX1 is bigger than tCHQZ. The specs as shown do not imply bus contention because tCHQX1 is a MIN
parameter that is worst case at totally different test conditions (0°C, 1.9 V) than tCHQZ, which is a MAX parameter (worst case at 70°C, 1.7 V). It is not possible for two
SRAMs on the same board to be at such different voltages and temperatures.
6. Clock phase jitter is the variance from clock rising edge to the next expected clock rising edge.
7. VDD slew rate must be less than 0.1 V DC per 50 ns for DLL lock retention. DLL lock time begins once VDD and input clock are stable.
8. Echo clock is very tightly controlled to data valid/data hold. By design, there is a ±0.1 ns variation from echo clock to data. The datasheet parameters reflect tester guard
bands and test setup variations.
Rev: 1.03d 11/2011
21/36
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2007, GSI Technology