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GS820E32AT Datasheet, PDF (12/21 Pages) GSI Technology – 64K x 32 2Mb Synchronous Burst SRAM
GS820E32AT-180/166/133/4/5
Undershoot Measurement and Timing
VIH
VSS
50%
VSS – 2.0 V
20% tKC
Overshoot Measurement and Timing
VDD +- 2.0 V
50%
20% tKC
VDD
VIL
Capacitance
(TA = 25°C, f = 1 MHZ, VDD = 3.3 V)
Parameter
Control Input Capacitance
Input Capacitance
Output Capacitance
Note:
This parameter is sample tested.
Symbol
CI
CIN
COUT
Test conditions
VDD = 3.3 V
VIN = 0 V
VOUT = 0 V
AC Test Conditions
Parameter
Conditions
Input high level
2.3 V
Input low level
0.2 V
Input slew rate
1 V/ns
Input reference level
1.25 V
Output reference level
1.25 V
Output load
Fig. 1& 2
Notes:
1. Include scope and jig capacitance.
2. Test conditions as specified with output loading as shown in Fig. 1 unless otherwise noted.
3. Output Load 2 for tLZ, tHZ, tOLZ and tOHZ
4. Device is deselected as defined by the Truth Table.
Typ. Max. Unit
3
4
pF
4
5
pF
6
7
pF
Output Load 1
DQ
50Ω
30pF*
VT = 1.25 V
* Distributed Test Jig Capacitance
Rev: 1.07 10/2004
12/21
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2000, GSI Technology