MB85RS16N Datasheet, PDF (21/36 Pages) Fujitsu Component Limited. – 16 K (2 K × 8) Bit SPI

■ PACKAGE DIMENSION
8-pin plastic SOP
(FPT-8P-M02)
8-pin plastic SOP
(FPT-8P-M02)
*¹
5.05
+0.25
–0.20
.199
+.010
–.008
8
5
MB85RS16N
Lead pitch
Package width ×
package length
Lead shape
Sealing method
Mounting height
Weight
1.27 mm
3.9 mm × 5.05 mm
Gullwing
Plastic mold
1.75 mm MAX
0.06 g
Note 1) *1 : These dimensions include resin protrusion.
Note 2) *2 : These dimensions do not include resin protrusion.
Note 3) Pins width and pins thickness include plating thickness.
Note 4) Pins width do not include tie bar cutting remainder.
0.22
+0.03
–0.07
.009
+.001
–.003
1
1.27(.050)
*² 3.90±0.30 6.00±0.20
(.154±.012) (.236±.008)
45°
0.40(.016)
4
0.44±0.08
(.017±.003)
0.13(.005) M
0.10(.004)
C _{2002-2012 FUJITSU SEMICONDUCTOR LIMITED F08004S-c-5-10}
Details of "A" part
1.55±0.20
(.061±.008)
(Mounting
height)
0.25(.010)
"A"
0~8°
0.50±0.20
(.020±.008)
0.60±0.15
(.024±.006)
0.15±0.10
(.006±.004)
(Stand off)
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
(Continued)
DS501-00030-3v0-E
21