908E624 Datasheet, PDF (6/40 Pages) Freescale Semiconductor, Inc – Integrated Triple High-Side Switch with Embedded MCU and LIN Serial Communication for Relay Drivers

ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings (continued)
All voltages are with respect to ground unless otherwise noted. Exceeding limits on any terminal may cause permanent
damage to the device.
Rating
Symbol
Value
Unit
THERMAL RATINGS
Package Operating Ambient Temperature ⁽⁴⁾
MM908E624ACDWB and MM908E624ACEW
MM908E624AYEW
Operating Junction Temperature ⁽²⁾⁽⁴⁾
MM908E624ACDWB and MM908E624ACEW
MM908E624AYEW
T_A
°C
- 40 to 85
- 40 to 125
T_J
°C
- 40 to 125
- 40 to 125
Storage Temperature
Peak Package Reflow Temperature During Solder Mounting ⁽³⁾
DWB Suffix
EW (Pb-Free) Suffix
T_STG
T_SOLDER
- 40 to 150
°C
°C
245
260
Notes
2. The temperature of analog and MCU die is strongly linked via the package, but can differ in dynamic load conditions, usually because
of higher power dissipation of the analog die. The analog die junction temperature must not exceed 150°C under these conditions.
3. Terminal soldering temperature is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
4. Independent of T_A, device parametrics are only guaranteed for -40 < T_J < 125°C . Please see note 2. T_J is a factor of power dissipation,
package thermal resistance, and available heat sinking.
908E624
6
Analog Integrated Circuit Device Data
Freescale Semiconductor