908E624 Datasheet, PDF (37/40 Pages) Freescale Semiconductor, Inc – Integrated Triple High-Side Switch with Embedded MCU and LIN Serial Communication for Relay Drivers

ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 3.0)
PTB7/AD7/TBCH1
1
PTB6 / AD6 / TBCH0
2
PTC4 /OSC1
3
PTC3 /OSC2
4
PTC2/MCLK
5
PTB5/AD5
6
PTB4/AD4
7
PTB3/AD3
8
IRQ
9
RST
10
PTB1/AD1
11
PTD0 / TACH0
12
PTD1/TACH1
13
NC
14
NC
15
NC
16
PWMIN
17
RST_A
18
IRQ_A
19
NC
20
NC
21
NC
22
L1
23
L2
24
HS3
25
HS2
26
HS1
27
54
PTA0 / KBD0
53
PTA1/ KBD1
52
PTA2 / KBD2
51
FLSVPP
50
PTA3 / KBD3
49
PTA4 / KBD4
48
VREFH
47
VDDA
46
EVDD
45
EVSS
44
VSSA
43
VREFL
42
PTE1/ RXD
41
NC
40
RXD
39
WDCONF
38
+E
37
-E
36
OUT
35
VCC
34
AGND
33
VDD
32
NC
31
VSUP1
30
GND
29
LIN
28
VSUP2
908E624 Terminal Connections
54-Terminal SOICW
0.65 mm Pitch
17.9 mm x 7.5 mm Body
A
Figure 22. Surface Mount for SOIC Wide Body
non-Exposed Pad
Device on Thermal Test Board
Material:
Single layer printed circuit board
FR4, 1.6 mm thickness
Cu traces, 0.07 mm thickness
Outline:
80 mm x 100 mm board area,
including edge connector for thermal
testing
Area A:
Cu heat-spreading areas on board
surface
Ambient Conditions: Natural convection, still air
Table 17. Thermal Resistance Performance
Terminal
Resistance
Area A
(mm²)
1 = Power Chip, 2 = Logic Chip (°C/W)
m = 1,
n=1
m = 1, n = 2
m = 2, n = 1
m = 2,
n=2
R_θJAmn
0
58
48
53
300
56
46
51
600
54
45
50
R_θJAmn is the thermal resistance between die junction and
ambient air.
This device is a dual die package. Index m indicates the
die that is heated. Index n refers to the number of the die
where the junction temperature is sensed.
Analog Integrated Circuit Device Data
Freescale Semiconductor
908E624
37