33982B Datasheet, PDF (6/34 Pages) Freescale Semiconductor, Inc – Single Intelligent High-Current Self-Protected Silicon High-Side Switch (2.0 mohm)

ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to ground unless otherwise noted.
Rating
Symbol
Value
Unit
THERMAL RATINGS
Operating Temperature
Ambient
Junction
Storage Temperature
Thermal Resistance ⁽⁵⁾
Junction-to-Case
Junction-to-Ambient
Peak Package Reflow Temperature During Reflow ⁽⁶⁾, ⁽⁷⁾
T_A
T_J
T_STG
R_θJC
R_θJA
T_PPRT
- 40 to 125
- 40 to 150
- 55 to 150
<1.0
20
Note 7
°C
°C
°C/W
°C
Notes
1. Exceeding this voltage limit may cause permanent damage to the device.
2. Continuous high-side output current rating so long as maximum junction temperature is not exceeded. Calculation of maximum output
current using package thermal resistance is required.
3. Active clamp energy using single-pulse method (L = 16 mH, R_L = 0, V_PWR = 12 V, T_J = 150°C).
4. ESD1 testing is performed in accordance with the Human Body Model (HBM) (C_ZAP = 100 pF, R_ZAP = 1500 Ω); ESD3 testing is
performed in accordance with the Charge Device Model (CDM), Robotic (Czap = 4.0 pF).
5. Device mounted on a 2s2p test board per JEDEC JESD51-2.
6. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
7. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL),
Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e.
MC33xxxD enter 33xxx), and review parametrics.
33982
6
Analog Integrated Circuit Device Data
Freescale Semiconductor