33982B Datasheet, PDF (31/34 Pages) Freescale Semiconductor, Inc – Single Intelligent High-Current Self-Protected Silicon High-Side Switch (2.0 mohm)

ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 3.0)
A Transparent Top View
12 11 10 9 8 7 6 5 4 3 2 1
13
GND
14
VPWR
A
15
HS
16
HS
33982B Pin Connections
16-Pin PQFN
0.90 mm Pitch
12.0 mm x 12.0 mm Body
Figure 13. Thermal Test Board
Device on Thermal Test Board
Material:
Single layer printed circuit board
FR4, 1.6 mm thickness
Cu traces, 0.07 mm thickness
Outline:
80 mm x 100 mm board area,
including edge connector for thermal
testing
Area A:
Cu heat-spreading areas on board
surface
Ambient Conditions: Natural convection, still air
Table 19. Thermal Resistance Performance
Thermal
Resistance
Area A
(mm²)
0
1 = Power Chip, 2 = Logic Chip (°C/W)
m = 1,
n=1
m = 1, n = 2
m = 2, n = 1
m = 2,
n=2
55
42
74
R_θJAmn
300
41
32
66
600
39
29
65
R_θJA is the thermal resistance between die junction and
ambient air.
This device is a dual die package. Index m indicates the
die that is heated. Index n refers to the number of the die
where the junction temperature is sensed.
Analog Integrated Circuit Device Data
Freescale Semiconductor
33982
31