33982B Datasheet, PDF (27/34 Pages) Freescale Semiconductor, Inc – Single Intelligent High-Current Self-Protected Silicon High-Side Switch (2.0 mohm)

PACKAGING
SOLDERING INFORMATION
PACKAGING
SOLDERING INFORMATION
SOLDERING INFORMATION
The 33982B is packaged in a surface mount power
package intended to be soldered directly on the printed circuit
board.
The 33982B was qualified in accordance with JEDEC
standards JESD22-A113-B and J-STD-020A. The
recommended reflow conditions are as follows:
• Convection: 225°C +5.0/-0°C
• Vapor Phase Reflow (VPR): 215°C to 219°C
• Infrared (IR)/Convection: 225°C +5.0/-0°C
The maximum peak temperature during the soldering
process should not exceed 230°C. The time at maximum
temperature should range from 10 s to 40 s maximum.
Analog Integrated Circuit Device Data
Freescale Semiconductor
33982
27