33975 Datasheet, PDF (5/32 Pages) Freescale Semiconductor, Inc – Multiple Switch Detection Interface with Suppressed Wake-Up and 32mA Wetting Current

MAXIMUM RATINGS
MAXIMUM RATINGS
Table 3. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these limits may cause malfunction or permanent
damage to the device.
Rating
Symbol
Value
Unit
ELECTRICAL RATINGS
V_DD Supply Voltage
CS, SI, SO, SCLK, INT, AMUX
WAKE
V_PWR Supply Voltage
Switch Input Voltage Range
MC33975
PC339775A
Frequency of SPI Operation (V_DD = 5.0 V)
ESD Voltage ⁽¹⁾
Human Body Model ⁽²⁾
Applies to all non-input terminals
Machine Model
Charge Device Model
Corner Terminals
Interior Terminals
–
–
–
–
–
–
V_ESD
-0.3 to 7.0
-0.3 to 7.0
-0.3 to 40
-0.3 to 50
-14 to 38
-14 to 40
6.0
±4000
±2500
±200
750
500
V_DC
V_DC
V_DC
V_DC
V_DC
MHz
V
THERMAL RATINGS
Operating Temperature
Ambient
Junction
Case
Storage Temperature
Power Dissipation ⁽³⁾
Thermal Resistance
Junction to Ambient
Between the Die and the Exposed Die Pad ⁽⁴⁾
Peak Package Reflow Temperature During Solder Mounting ⁽⁵⁾
T_A
T_J
T_C
T_STG
P_D
R_θJA
R_θJC
T_SOLDER
-40 to 125
-40 to 150
-40 to 125
-55 to 150
1.7
71
1.2
245
°C
°C
W
°C/W
°C
Notes
1. ESD testing is performed in accordance with the Human Body Model (C_ZAP = 100 pF, R_ZAP = 1500 Ω), the Machine Model (C_ZAP = 200
pF, R_ZAP = 0 Ω), and the Charge Device Model.
2. All Programmable Switches (SP) and Switch-to-Ground (SG) input terminals when tested individually.
3. Maximum power dissipation at T_J =150°C junction temperature with no heatsink used.
4. Thermal resistance between the die and the exposed die pad.
5. Terminal soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits
may cause malfunction or permanent damage to the device.
Analog Integrated Circuit Device Data
Freescale Semiconductor
33975
5