MC9S08LG32_09 Datasheet, PDF (39/50 Pages) Freescale Semiconductor, Inc – 8-bit HCS08 Central Processor Unit (CPU)

Package Information
3.1 Device Numbering System
Example of the device numbering system:
S 9 S08 LG 32 J0 X XX
Status/Partnumber Type
(S = Maskset specific partnumber)
Memory
(9 = FLASH-based)
Core
Family
Package designator (see Table 23)
Temperature range
(C = –40 °C to 85 °C)
(V = –40 °C to 105 °C)
Maskset Identifier Suffix
(First digit usually references wafer fab
Second digit usually differentiates mask rev)
Approximate Flash size in KB
Figure 31. Device Number Example for Auto Parts
MC 9 S08 LG 32 C XX
Status
(MC = Fully Qualified)
Memory
(9 = FLASH-based)
Core
Family
Package designator (see Table 23)
Temperature range
(C = –40 °C to 85 °C)
Approximate Flash size in KB
Figure 32. Device Number Example for IMM Parts
4 Package Information
Table 23. Package Descriptions
Pin Count
80
64
48
Package Type
Low Quad Flat Package
Low Quad Flat Package
Low Quad Flat Package
Abbreviation
LQFP
LQFP
LQFP
Designator
LK
LH
LF
Case No.
917A
840F
932
Document No.
98ASS23237W
98ASS23234W
98ASH00962A
4.1 Mechanical Drawings
The following pages are mechanical drawings for the packages described in Table 23. For the latest
available drawings please visit our web site (http://www.freescale.com) and enter the package’s document
number into the keyword search box.
MC9S08LG32 Series Data Sheet, Rev. 7
Freescale Semiconductor
39