MC9S08GW64_11 Datasheet, PDF (39/42 Pages) Freescale Semiconductor, Inc – HC08 instruction set with added BGND instruction

Electrical Characteristics
1 _{All accuracy numbers assume the ADC is calibrated with VREFH=VDDAD}
2 _{Typical values assume VDDAD = 3.0 V, Temp = 25 C, fADCK=2.0MHz unless otherwise stated. Typical values are for reference}
only and are not tested in production.
3 _{1 LSB = (VREFH–VREFL)/2}N
3.13 VREF Characteristics
Table 20. Electrical specifications
Num
C
Characteristic
Symbol
Min
Max
1
P Supply voltage
2
P Operating temperature range
3
C Maximum Load
V_DD
1.80
3.60
T_op
–40
85
10
Operation across Temperature
4
P Voltage output room temperature
Untrimmed
5
P Voltage output room temperature
Factory trimmed¹
1.070–1.3
1.180–1.22
6
C –40 °C
Factory trimmed
1.19–1.200
7
C 85 °C
Factory trimmed
1.185–1.200
Load Bandwidth
8
C Load Regulation Mode = 10 at 1mA
Mode = 10
20
100
load
9
C Line Regulation (Power Supply
Rejection)
DC
±0.1 from room temp voltage
AC
–60
Power Consumption
10
C Powered down Current (Stop Mode,
I
100
VREFEN = 0, VRSTEN = 0)
11
C Bandgap only (Mode[1:0] 00)
I
75
12
C Low Power buffer (Mode[1:0] 01)
I
125
13
C Tight Regulation buffer (Mode[1:0] 10)
I
1.1
14
C Low Power and Tight Regulation
I
1.15
(Mode[1:0] 11)
1 _{Factory trim is performed at the room temperature.}
Unit
V
C
mA
V
V
V
V
V/mA
mV
dB
A
A
A
mA
mA
MC9S08GW64 Series MCU Data Sheet, Rev. 3
Freescale Semiconductor
39