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MC9S08GW64_11 Datasheet, PDF (11/42 Pages) Freescale Semiconductor, Inc – HC08 instruction set with added BGND instruction
Electrical Characteristics
high-impedance circuit. Reliability of operation is enhanced if unused inputs are tied to an appropriate logic voltage level (for
instance, either VSS or VDD) or the programmable pull-up resistor associated with the pin is enabled.
Table 4. Absolute Maximum Ratings
Rating
Symbol
Value
Unit
Supply voltage
VDD
–0.3 to +3.8
V
Maximum current into VDD
IDD
120
mA
Digital input voltage
VIn
–0.3 to VDD + 0.3
V
Instantaneous maximum current
ID
Single pin limit (applies to all port pins except PTA5
and PTB1)1, 2, 3
 25
mA
Instantaneous maximum current
ID
Single pin limit (applies to PTA5 and PTB1)1,2,3
 50
mA
Storage temperature range
Tstg
–55 to 150
C
1 Input must be current limited to the value specified. To determine the value of the required
current-limiting resistor, calculate resistance values for positive (VDD) and negative (VSS) clamp
voltages, then use the larger of the two resistance values.
2 All functional non-supply pins are internally clamped to VSS and VDD.
3 Power supply must maintain regulation within operating VDD range during instantaneous and
operating maximum current conditions. If positive injection current (VIn > VDD) is greater than
IDD, the injection current may flow out of VDD and could result in external power supply going
out of regulation. Ensure external VDD load will shunt current greater than maximum injection
current. This will be the greatest risk when the MCU is not consuming power. Examples are: if
no system clock is present, or if the clock rate is very low (which would reduce overall power
consumption).
3.4 Thermal Characteristics
This section provides information about operating temperature range, power dissipation, and package thermal resistance. Power
dissipation on I/O pins is usually small compared to the power dissipation in on-chip logic and voltage regulator circuits, and
it is user-determined rather than being controlled by the MCU design. To take PI/O into account in power calculations, determine
the difference between actual pin voltage and VSS or VDD and multiply by the pin current for each I/O pin. Except in cases of
unusually high pin current (heavy loads), the difference between pin voltage and VSS or VDD will be very small.
Table 5. Thermal Characteristics
Rating
Operating temperature range
(packaged)
Maximum junction temperature
Thermal resistance
Single-layer board
80-pin LQFP
64-pin LQFP
Thermal resistance
Four-layer board
80-pin LQFP
64-pin LQFP
Symbol
TA
TJ
JA
Value
Unit
TL to TH
C
–40 to 85
95
C
61
C/W
70
JA
48
C/W
52
MC9S08GW64 Series MCU Data Sheet, Rev. 3
Freescale Semiconductor
11