MC9S08MP16 Datasheet, PDF (35/36 Pages) Freescale Semiconductor, Inc – 8-Bit HCS08 Central Processor Unit (CPU)

3.1 Device Numbering Scheme
Example of the device numbering system:
xx 9 S08 MP nn E2 y zz
Status
MC = Consumer &
Industrial
S = Automotive Qualified
Memory
9 = Flash-based
Core
Family
Package Information
Package designator (see Table 23)
Temperature range
V = –40°C to 105°C
M = –40°C to 125°C
Wafer fab site and mask revision
(this field appears only in automotive-qualified
part numbers)
Flash size
16 KBytes
12 KBytes
4 Package Information
The latest package outline drawings are available on the product summary pages on our web site:
http://www.freescale.com/8bit. The following table lists the document numbers per package. Use these numbers in the web
page’s keyword search engine to find the latest package outline drawings.
NOTE
The 32 LQFP and 28 SOIC are not qualified to meet automotive requirements.
Table 23. Package Descriptions
Pin Count
Package Type
Abbreviation Designator
Case No.
Document No.
48
Low Quad Flat Pack
LQFP
32
Low Quad Flat Pack
LQFP
28
Small Outline Integrated Circuit
SOIC
LF
932-03
98ASH00962A
LC
873A-03
98ASH70029A
WL
751F-05
98ASB42345B
5 Related Documentation
Find the most current versions of all documents at http://www.freescale.com.
Reference Manual
(MC9S08MP16RM)
Contains extensive product information including modes of operation, memory,
resets and interrupts, register definition, port pins, CPU, and all module
information.
6 Revision History
To provide the most up-to-date information, the revision of our documents on the World Wide Web are the most current. Your
printed copy may be an earlier revision. To verify you have the latest information available, refer to:
http://www.freescale.com
MC9S08MP16 Series Data Sheet, Rev. 1
Freescale Semiconductor
35