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MC9S08MP16 Datasheet, PDF (33/36 Pages) Freescale Semiconductor, Inc – 8-Bit HCS08 Central Processor Unit (CPU)
Electrical Characteristics
2.15 Flash Memory Specifications
This section provides details about program/erase times and program-erase endurance for the flash memory.
Program and erase operations do not require any special power sources other than the normal VDD supply. For more detailed
information about program/erase operations, see the Memory section.
Table 20. Flash Memory Characteristics
Num C
Characteristic
Symbol
Min
Typical
Max
Unit
1
— Supply voltage for program/erase
-40°C to 125°C
Vprog/erase
2.7
5.5
V
2
— Supply voltage for read operation
3
— Internal FCLK frequency1
VRead
2.7
fFCLK
150
5.5
V
200
kHz
4
— Internal FCLK period (1/FCLK)
5
C Byte program time (random location)2
6
— Byte program time (burst mode)2
7
D Page erase time2
8
D Mass erase time2
9
C Byte program current3
10
C Page erase current3
Program/erase endurance4
11
C
TL to TH = –40°C to + 125°C
T = 25°C
tFcyc
tprog
tBurst
tPage
tMass
RIDDBP
RIDDPE
5
—
—
10,000
9
4
4000
20,000
4
6
—
100,000
6.67
—
—
—
—
μs
tFcyc
tFcyc
tFcyc
tFcyc
mA
mA
cycles
12
C Data retention5
tD_ret
15
100
—
years
1 The frequency of this clock is controlled by a software setting.
2 These values are hardware state machine controlled. User code does not need to count cycles. This information supplied for
calculating approximate time to program and erase.
3 The program and erase currents are additional to the standard run IDD. These values are measured at room temperatures with
VDD = 5.0 V, bus frequency = 4.0 MHz.
4 Typical endurance for Flash is based upon the intrinsic bit cell performance. For additional information on how Freescale defines
typical endurance, please refer to Engineering Bulletin EB619/D, Typical Endurance for Nonvolatile Memory.
5 Typical data retention values are based on intrinsic capability of the technology measured at high temperature and de-rated to
25°C using the Arrhenius equation. For additional information on how Freescale defines typical data retention, please refer to
Engineering Bulletin EB618/D, Typical Data Retention for Nonvolatile Memory.
2.16 EMC Performance
Electromagnetic compatibility (EMC) performance is highly dependant on the environment in which the MCU resides. Board
design and layout, circuit topology choices, location and characteristics of external components as well as MCU software
operation all play a significant role in EMC performance. The system designer should consult Freescale applications notes such
as AN2321, AN1050, AN1263, AN2764, and AN1259 for advice and guidance specifically targeted at optimizing EMC
performance.
2.16.1 Radiated Emissions
Microcontroller radiated RF emissions are measured from 150 kHz to 1 GHz using the TEM/GTEM Cell method in accordance
with the IEC 61967-2 and SAE J1752/3 standards. The measurement is performed with the microcontroller installed on a
MC9S08MP16 Series Data Sheet, Rev. 1
Freescale Semiconductor
33