33984 Datasheet, PDF (35/38 Pages) Freescale Semiconductor, Inc – Dual Intelligent High-current Self-protected Silicon High Side Switch (4.0 mOhm)

A
A Transparent Top View
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 3.0)
12 11 10 9 8 7 6 5 4 3 2 1
13
GND
14
VPWR
A
15
16
HS1
HS0
33984 Pin Connections
16-Pin PQFN
0.90 mm Pitch
12.0 mm x 12.0 mm Body
Figure 2. Thermal Test Board
Device on Thermal Test Board
Material:
Single layer printed circuit board
FR4, 1.6 mm thickness
Cu traces, 0.07 mm thickness
Table 2. Thermal Resistance Performance
Thermal
Resistance
Area A
(mm²)
1 = Power Chip, 2 = Logic Chip (°C/W)
m = 1,
n=1
m = 1, n = 2
m = 2, n = 1
m = 2,
n=2
Outline:
80 mm x 100 mm board area,
including edge connector for
thermal testing
Area A:
Cu heat-spreading areas on board
surface
Ambient Conditions: Natural convection, still air
0
55
42
74
R_θJAmn
300
41
31
66
600
38
29
64
R_θJA is the thermal resistance between die junction and
ambient air.
This device is a dual die package. Index m indicates the
die that is heated. Index n refers to the number of the die
where the junction temperature is sensed.
Analog Integrated Circuit Device Data
Freescale Semiconductor
33984
35