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K40P144M100SF2_11 Datasheet, PDF (33/75 Pages) Freescale Semiconductor, Inc – Up to 100 MHz ARM Cortex-M4 core with DSP instructions delivering 1.25 Dhrystone MIPS per MHz
Peripheral operating requirements and behaviors
Table 19. Flash command timing specifications (continued)
Symbol Description
Min.
Typ.
teewr16bers Word-write to erased FlexRAM location
execution time
—
100
Word-write to FlexRAM execution time:
teewr16b32k
teewr16b64k
teewr16b128k
teewr16b256k
• 32 KB EEPROM backup
• 64 KB EEPROM backup
• 128 KB EEPROM backup
• 256 KB EEPROM backup
—
TBD
—
TBD
—
TBD
—
TBD
Longword-write to FlexRAM for EEPROM operation
teewr32bers Longword-write to erased FlexRAM location
execution time
—
200
Longword-write to FlexRAM execution time:
teewr32b32k
teewr32b64k
teewr32b128k
teewr32b256k
• 32 KB EEPROM backup
• 64 KB EEPROM backup
• 128 KB EEPROM backup
• 256 KB EEPROM backup
—
TBD
—
TBD
—
TBD
—
TBD
Max.
TBD
TBD
1.5
TBD
2.5
TBD
TBD
2.7
TBD
3.7
Unit
Notes
μs
ms
ms
ms
ms
μs
ms
ms
ms
ms
1. Assumes 25MHz flash clock frequency.
2. Maximum times for erase parameters based on expectations at cycling end-of-life.
3. For byte-writes to an erased FlexRAM location, the aligned word containing the byte must be erased.
6.4.1.3 Flash (FTFL) current and power specfications
Table 20. Flash (FTFL) current and power specfications
Symbol
IDD_PGM
Description
Worst case programming current in program flash
Typ.
Unit
10
mA
6.4.1.4 Reliability specifications
Table 21. NVM reliability specifications
Symbol Description
tnvmretp10k Data retention after up to 10 K cycles
tnvmretp1k Data retention after up to 1 K cycles
tnvmretp100 Data retention after up to 100 cycles
nnvmcycp Cycling endurance
tnvmretd10k Data retention after up to 10 K cycles
Min.
Program Flash
5
10
15
10 K
Data Flash
5
Typ.1
TBD
TBD
TBD
TBD
TBD
Max.
—
—
—
—
—
Table continues on the next page...
Unit
years
years
years
cycles
years
Notes
2
2
2
3
2
K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011.
Freescale Semiconductor, Inc.
Preliminary
33