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K40P144M100SF2_11 Datasheet, PDF (19/75 Pages) Freescale Semiconductor, Inc – Up to 100 MHz ARM Cortex-M4 core with DSP instructions delivering 1.25 Dhrystone MIPS per MHz
5.1.6 EMC radiated emissions operating behaviors
Table 7. EMC radiated emissions operating behaviors
General
Symbol Description
VRE1
Radiated emissions voltage, band 1
VRE2
Radiated emissions voltage, band 2
VRE3
Radiated emissions voltage, band 3
VRE4
Radiated emissions voltage, band 4
VRE_IEC_SAE IEC and SAE level
Frequency
band (MHz)
0.15–50
50–150
150–500
500–1000
0.15–1000
Typ.
TBD
TBD
TBD
TBD
TBD
Unit
dBμV
—
Notes
1, 2
2, 3
1. Determined according to IEC Standard 61967-1, Integrated Circuits - Measurement of Electromagnetic Emissions, 150
kHz to 1 GHz Part 1: General Conditions and Definitions, IEC Standard 61967-2, Integrated Circuits - Measurement of
Electromagnetic Emissions, 150 kHz to 1 GHz Part 2: Measurement of Radiated Emissions—TEM Cell and Wideband
TEM Cell Method, and SAE Standard J1752-3, Measurement of Radiated Emissions from Integrated Circuits—TEM/
Wideband TEM (GTEM) Cell Method.
2. VDD = 3 V, TA = 25 °C, fOSC = 12 MHz (crystal), fSYS = 96 MHz
3. Specified according to Annex D of IEC Standard 61967-2, Measurement of Radiated Emissions—TEM Cell and Wideband
TEM Cell Method, and Appendix D of SAE Standard J1752-3, Measurement of Radiated Emissions from Integrated
Circuits—TEM/Wideband TEM (GTEM) Cell Method.
5.1.7 Designing with radiated emissions in mind
To find application notes that provide guidance on designing your system to minimize
interference from radiated emissions:
1. Go to http://www.freescale.com.
2. Perform a keyword search for “EMC design.”
5.1.8 Capacitance attributes
Table 8. Capacitance attributes
Symbol
CIN_A
CIN_D
Description
Input capacitance: analog pins
Input capacitance: digital pins
Min.
Max.
Unit
—
7
pF
—
7
pF
5.2 Switching specifications
K40 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011.
Freescale Semiconductor, Inc.
Preliminary
19