MC68020FE33E Datasheet, PDF (295/306 Pages) Freescale Semiconductor, Inc – MICROPROCESSORS USER’S MANUAL

Freescale Semiconductor, Inc.
11.2.6 MC68020 FE Suffix—Package Dimensions
FE SUFFIX
CASE 831-01
MC68020
0.20 (0.008) M
0.51 (0.020) M
S
T X S —Y S Z S
A
T X S —Y S Z S
PIN 1 INDENT
VB
L
X
0.51 (0.020) M T X S — Y S Z S
0.20 (0.008) M T X S — Y S Z S
W
∩ 0.10 (0.004)
T SEATING PLANE
M
R
JH
C
D 132 PL
K
0.20 (0.008) M T X S — Y S Z S
MILLIMETERS
DIM MIN MAX
A 21.85 22.86
B 21.85 22.86
C 3.94 4.31
D 0.204 0.292
G
0.64 BSC
H 0.64 0.88
J 0.13 0.20
K 0.51 0.76
L
20.32 REF
M
0°
8°
R 0.64 —
INCHES
MIN MAX
0.860 0.900
0.860 0.900
0.155 0.170
0.0080 0.0115
0.025 BSC
0.025 0.035
0.005 0.008
0.020 0.030
0.800 REF
0°
8°
0.025
—
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH
3. DIMENSIONS A AND B DEFINE MAXIMUM CERAMIC BODY DIMENSIONS
INCLUDING GLASS PROTRUSION AND MISMATCH OF CERAMIC BODY
TOP AND BOTTOM.
4. DATUM PLANE -W- IS LOCATED AT THE UNDERSIDE OF LEADS
WHERE LEADS EXIT PACKAGE BODY.
5. DATUMS -X-, -Y-, AND -Z- TO BE DETERMINED WHERE CENTER LEADS
EXIT PACKAGE BODY AT DATUM -W-.
6. DIMENSIONS S AND V TO BE DETERMINED AT SEATING PLANE, DATUM -T-.
7. DIMENSIONS A AND B TO BE DETERMINED AT DATUM PLANE -W-.
MOTOROLA
MC68838 USER’S MANUAL
13-7
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