K10P64M50SF0 Datasheet, PDF (22/61 Pages) Freescale Semiconductor, Inc – K10 Sub-Family

Peripheral operating requirements and behaviors
Board type
Single-layer
(1s)
Symbol
R_θJMA
Four-layer
(2s2p)
R_θJMA
—
R_θJB
—
R_θJC
—
Ψ_JT
Description 64 MAPBGA
Thermal
90
resistance,
junction to
ambient (200 ft./
min. air speed)
Thermal
51
resistance,
junction to
ambient (200 ft./
min. air speed)
Thermal
31
resistance,
junction to
board
Thermal
31
resistance,
junction to case
Thermal
6
characterization
parameter,
junction to
package top
outside center
(natural
convection)
64 LQFP
53
40
28
15
3
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
Notes
1,3
,
5
6
7
1.
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board
thermal resistance.
2.
Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air) with the single layer board horizontal. For the LQFP, the board meets the
JESD51-3 specification. For the MAPBGA, the board meets the JESD51-9 specification.
3.
Determined according to JEDEC Standard JESD51-6, Integrated Circuits Thermal Test Method Environmental
Conditions—Forced Convection (Moving Air) with the board horizontal.
5.
Determined according to JEDEC Standard JESD51-8, Integrated Circuit Thermal Test Method Environmental
Conditions—Junction-to-Board. Board temperature is measured on the top surface of the board near the package.
6.
Determined according to Method 1012.1 of MIL-STD 883, Test Method Standard, Microcircuits, with the cold plate
temperature used for the case temperature. The value includes the thermal resistance of the interface material
between the top of the package and the cold plate.
7.
Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air).
6 Peripheral operating requirements and behaviors
6.1 Core modules
K10 Sub-Family Data Sheet, Rev. 4 5/2012.
22
Freescale Semiconductor, Inc.