K10P64M50SF0 Datasheet, PDF (2/61 Pages) Freescale Semiconductor, Inc – K10 Sub-Family

Table of Contents
1 Ordering parts...........................................................................3
5.3.2 General switching specifications...........................20
1.1 Determining valid orderable parts......................................3
5.4 Thermal specifications.......................................................21
2 Part identification......................................................................3
5.4.1 Thermal operating requirements...........................21
2.1 Description.........................................................................3
5.4.2 Thermal attributes.................................................21
2.2 Format...............................................................................3
6 Peripheral operating requirements and behaviors....................22
2.3 Fields.................................................................................3
6.1 Core modules....................................................................22
2.4 Example............................................................................4
6.1.1 JTAG electricals....................................................22
3 Terminology and guidelines......................................................4
6.2 System modules................................................................25
3.1 Definition: Operating requirement......................................4
6.3 Clock modules...................................................................25
3.2 Definition: Operating behavior...........................................5
6.3.1 MCG specifications...............................................25
3.3 Definition: Attribute............................................................5
6.3.2 Oscillator electrical specifications.........................27
3.4 Definition: Rating...............................................................6
6.3.3 32 kHz Oscillator Electrical Characteristics...........29
3.5 Result of exceeding a rating..............................................6
6.4 Memories and memory interfaces.....................................30
3.6 Relationship between ratings and operating
6.4.1 Flash electrical specifications................................30
requirements......................................................................6
6.4.2 EzPort Switching Specifications............................34
3.7 Guidelines for ratings and operating requirements............7
6.5 Security and integrity modules..........................................35
3.8 Definition: Typical value.....................................................7
6.6 Analog...............................................................................35
3.9 Typical value conditions....................................................8
6.6.1 ADC electrical specifications.................................35
4 Ratings......................................................................................9
6.6.2 CMP and 6-bit DAC electrical specifications.........40
4.1 Thermal handling ratings...................................................9
6.6.3 Voltage reference electrical specifications............43
4.2 Moisture handling ratings..................................................9
6.7 Timers................................................................................44
4.3 ESD handling ratings.........................................................9
6.8 Communication interfaces.................................................44
4.4 Voltage and current operating ratings...............................9
6.8.1 DSPI switching specifications (limited voltage
5 General.....................................................................................10
range)....................................................................44
5.1 AC electrical characteristics..............................................10
6.8.2 DSPI switching specifications (full voltage range).46
5.2 Nonswitching electrical specifications...............................10
6.8.3 I2C switching specifications..................................48
5.2.1 Voltage and current operating requirements.........10
6.8.4 UART switching specifications..............................48
5.2.2 LVD and POR operating requirements.................11
6.8.5 I2S/SAI Switching Specifications..........................48
5.2.3 Voltage and current operating behaviors..............12
6.9 Human-machine interfaces (HMI)......................................52
5.2.4 Power mode transition operating behaviors..........13
6.9.1 TSI electrical specifications...................................52
5.2.5 Power consumption operating behaviors..............14
7 Dimensions...............................................................................54
5.2.6 EMC radiated emissions operating behaviors.......18
7.1 Obtaining package dimensions.........................................54
5.2.7 Designing with radiated emissions in mind...........19
8 Pinout........................................................................................54
5.2.8 Capacitance attributes..........................................19
8.1 K10 Signal Multiplexing and Pin Assignments..................54
5.3 Switching specifications.....................................................19
8.2 K10 Pinouts.......................................................................57
5.3.1 Device clock specifications...................................19
9 Revision History........................................................................59
K10 Sub-Family Data Sheet, Rev. 4 5/2012.
2
Freescale Semiconductor, Inc.