33926 Datasheet, PDF (20/24 Pages) Freescale Semiconductor, Inc – 5.0 A Throttle Control H-Bridge

ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
IN2 ^{1 32 31 30 29 28 27 26 25} NC
IN1 2
SLEW 3
24 PGND
23 PGND
A
VPWR ⁴
AGND 5
AGND
22 PGND
21 SF
VPWR 6
20 PGND
INV 7
19 PGND
FB 8
18 PGND
NC 9 10 11 12 13 14 15 16 17 NC
33926PNB Pin Connections
32-Pin PQFN
0.80 mm Pitch
8.0 mm x 8.0 mm Body
Figure 15. Thermal Test Board
Device on Thermal Test Board
Material:
Single layer printed circuit board
FR4, 1.6 mm thickness
Cu traces, 0.07 mm thickness
Outline:
80 mm x 100 mm board area,
including edge connector for thermal
testing
Area A:
Cu heat-spreading areas on board
surface
Ambient Conditions: Natural convection, still air
Table 7. Thermal Resistance Performance
A [mm²]
R_θJA [°C/W]
0
81
300
49
600
40
R_θJA is the thermal resistance between die junction and
ambient air.
33926
20
Analog Integrated Circuit Device Data
Freescale Semiconductor