MC9S08PT60 Datasheet, PDF (18/37 Pages) Freescale Semiconductor, Inc – MC9S08PT60

Peripheral operating requirements and behaviors
θ_JA = Package thermal resistance, junction-to-ambient, °C/W
P_D = P_int + P_I/O
P_int = I_DD × V_DD, Watts - chip internal power
P_I/O = Power dissipation on input and output pins - user determined
For most applications, P_I/O << P_int and can be neglected. An approximate relationship
between P_D and T_J (if P_I/O is neglected) is:
P_D = K ÷ (T_J + 273 °C)
Solving the equations above for K gives:
K = P_D × (T_A + 273 °C) + θ_JA × (P_D)²
where K is a constant pertaining to the particular part. K can be determined by measuring
P_D (at equilibrium) for an known T_A. Using this value of K, the values of P_D and T_J can
be obtained by solving the above equations iteratively for any value of T_A.
6 Peripheral operating requirements and behaviors
6.1 External oscillator (XOSC) and ICS characteristics
Table 9. XOSC and ICS specifications (temperature range = -40 to 105 °C ambient)
Num C
Characteristic
Symbol
Min
Typical¹
Max
Unit
1
C
Oscillator
Low range (RANGE = 0)
f_lo
32
—
40
kHz
crystal or
C
resonator
High range (RANGE = 1)
f_hi
4
—
20
MHz
FEE or FBE mode²
C
High range (RANGE = 1),
f_hi
4
—
20
MHz
high gain (HGO = 1),
FBELP mode
C
High range (RANGE = 1),
f_hi
4
—
20
MHz
low power (HGO = 0),
FBELP mode
2
D
Load capacitors
C1, C2
See Note³
Table continues on the next page...
MC9S08PT60 Series Data Sheet, Rev. 3, 4/2012.
18
Freescale Semiconductor, Inc.