MCIMX25_1 Datasheet, PDF (122/132 Pages) Freescale Semiconductor, Inc – i.MX25 Applications Processor for Consumer and Industrial Products

• Maximum solder bump diameter measured parallel to datum A.
• Datum A, the seating plane, is determined by the spherical crowns of the solder bumps.
• Parallelism measurement shall exclude any effect of mark on top surface of package.
Figure 98. izzxz .MX25 Production Package
4.2 Ground, Power, Sense, and Reference Contact Assignments
Figure 96 shows ground, power, sense, and reference contact assignments.
Table 96. Ground, Power Sense, and Reference Contact Assignments
Contact Name
BATT_VDD
FUSE_VDD
MPLL_GND
MPLL_VDD
NGND_ADC
NVCC_ADC
NVCC_CRM
P10
T17
U17
U18
Y13
W13
N14
Contact Assignment
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 1
122
Freescale Semiconductor