MCIMX35_10 Datasheet, PDF (1/148 Pages) Freescale Semiconductor, Inc – i.MX35 Applications Processors for Industrial and Consumer Products

Freescale Semiconductor
Data Sheet: Technical Data
Document Number: MCIMX35SR2AEC
Rev. 8, 04/2010
MCIMX35
i.MX35 Applications
Processors for
Automotive Products
Silicon Revisions 2.0 and 2.1
Package Information
Plastic package
Case 5284 17 x 17 mm, 0.8 mm Pitch
Ordering Information
See Table 1 on page 3 for ordering information.
1 Introduction
The i.MX35 Auto Application Processor family is
designed for automotive infotainment and
navigation applications. These processors are
AECQ100 Grade 3 qualified and rated for ambient
operating temperatures up to 85 °C.
Based on an ARM11 microprocessor core running
at up to 532 MHz, the device offers the following
features and optimized system cost for the target
applications.
• Audio connectivity and telematics:
— Compressed audio playback from
storage devices (CD, USB, HDD or SD
card)
— PlayFromDevice (1-wire and 2-wire
support) for portable media players
— iPod/iPhone control and playback
— High-speed CD ripping to USB,
SD/MMC or HDD for virtual CD
changer
1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.2. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 3
1.3. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2. Functional Description and Application Information . . . . . 5
2.1. Application Processor Domain Overview . . . . . . . . 5
2.2. Shared Domain Overview . . . . . . . . . . . . . . . . . . . . 6
2.3. Advanced Power Management Overview . . . . . . . . 6
2.4. ARM11 Microprocessor Core . . . . . . . . . . . . . . . . . 6
2.5. Module Inventory . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3. Signal Descriptions: Special Function Related Pins . . . . 12
4. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 13
4.1. i.MX35 Chip-Level Conditions . . . . . . . . . . . . . . . . 13
4.2. Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
4.3. Supply Power-Up/Power-Down Requirements
and Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . 16
4.4. Reset Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
4.5. Power Characteristics . . . . . . . . . . . . . . . . . . . . . . 19
4.6. Thermal Characteristics . . . . . . . . . . . . . . . . . . . . 20
4.7. I/O Pin DC Electrical Characteristics . . . . . . . . . . 21
4.8. I/O Pin AC Electrical Characteristics . . . . . . . . . . 24
4.9. Module-Level AC Electrical Specifications . . . . . . 30
5. Package Information and Pinout . . . . . . . . . . . . . . . . . 131
5.1. MAPBGA Production Package 1568-01,
17 × 17 mm, 0.8 Pitch . . . . . . . . . . . . . . . . . . . . . 132
5.2. MAPBGA Signal Assignments . . . . . . . . . . . . . . 133
6. Product Documentation . . . . . . . . . . . . . . . . . . . . . . . . 145
7. Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 145
© Freescale Semiconductor, Inc., 2010. All rights reserved.