MCIMX27VOP4 Datasheet, PDF (1/118 Pages) Freescale Semiconductor, Inc – Multimedia Applications Processor

Freescale Semiconductor
Data Sheet, Advance Information
Document Number: MCIMX27
Rev. 0.1, 7/2007
This document contains information on a new
product. Specifications and information herein
are subject to change without notice.
i.MX27
i.MX27 Data Sheet
Multimedia Applications
Processor
Package Information
Plastic Package
Case 1816-01
(MAPBGA–404)
Ordering Information
See Table 1 on page 4 for ordering information.
1 Introduction
The i.MX27 (MCIMX27) Multimedia Applications
Processor represents the next step in low-power,
high-performance application processors.
Based on an ARM926EJ-S™ microprocessor core, the
i.MX27 processor provides the performance with
low-power consumption required by modern digital
devices such as the following:
• Feature-rich cellular phones
• Portable media players and mobile gaming
machines
• Personal digital assistants (PDAs) and wireless
PDAs
• Portable DVD players
• Digital cameras
The i.MX27 processor features the advanced and
power-efficient ARM926EJ-S core operating at speeds
up to 400 MHz, and is optimized for minimal power
consumption using the most advanced techniques for
power saving (for example, DPTC, power gating, and
Contents
1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.2 Block Diagram . . . . . . . . . . . . . . . . . . . . . . 2
1.3 Ordering Information . . . . . . . . . . . . . . . . . 4
2 Functional Description and Application
Information . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1 ARM926 Microprocessor Core Platform . . . 4
2.2 Module Inventory . . . . . . . . . . . . . . . . . . . . 5
2.3 Module Descriptions . . . . . . . . . . . . . . . . . . 9
3 Signal Descriptions . . . . . . . . . . . . . . . . . . . . 27
3.1 Power-Up Sequence . . . . . . . . . . . . . . . . 36
3.2 EMI Pins Multiplexing . . . . . . . . . . . . . . . . 36
3.3 Electrical Characteristics . . . . . . . . . . . . . 41
3.4 i.MX27 Chip-Level Conditions . . . . . . . . . 41
3.5 Module-Level Electrical Specifications . . . 45
4 Package Information and Pinout . . . . . . . . 103
4.1 Full Package Outline Drawing . . . . . . . . 103
4.2 Pin Assignments . . . . . . . . . . . . . . . . . . . 104
5 Product Documentation . . . . . . . . . . . . . . . 117
6 Revision History . . . . . . . . . . . . . . . . . . . . . 117
This document contains information on a product under development. Freescale reserves the right to change or discontinue this
product without notice.
© Freescale Semiconductor, Inc., 2007. All rights reserved.
Preliminary—Subject to Change Without Notice