FGH30N6S2_01 Datasheet, PDF (9/11 Pages) Fairchild Semiconductor – 600V, SMPS II Series N-Channel IGBT

TO-263AB
SURFACE MOUNT JEDEC TO-263AB PLASTIC PACKAGE
E
H₁
D
L
1
b
TERM. 4
3
e
e1
L₂
b₁
A
A₁
TERM. 4
L₁
c
J₁
0.450
(11.43)
b₂
3
1
L₃
0.700
(17.78)
0.350
(8.89)
0.150
(3.81)
0.080 TYP (2.03)
0.062 TYP (1.58)
MINIMUM PAD SIZE RECOMMENDED FOR
SURFACE-MOUNTED APPLICATIONS
INCHES
MILLIMETERS NOTE
SYMBOL MIN MAX MIN MAX
S
A
0.170 0.180 4.32 4.57
-
A₁
0.048 0.052 1.22 1.32 4, 5
b
0.030 0.034 0.77 0.86 4, 5
b₁
0.045 0.055 1.15 1.39 4, 5
b₂
0.310 -
7.88
-
2
c
0.018 0.022 0.46 0.55 4, 5
D
0.405 0.425 10.29 10.79
-
E
0.395 0.405 10.04 10.28
-
e
0.100 TYP
2.54 TYP
7
e₁
0.200 BSC
5.08 BSC
7
H₁
0.045 0.055 1.15 1.39
-
J₁
0.095 0.105 2.42 2.66
-
L
0.175 0.195 4.45 4.95
-
L₁
L₂
L₃
NOTES:
0.090 0.110 2.29 2.79 4, 6
0.050 0.070 1.27 1.77
3
0.315 -
8.01
-
2
1. These dimensions are within allowable dimensions of
Rev. C of JEDEC TO-263AB outline dated 2-92.
2. L₃ and b₂ dimensions established a minimum mounting
surface for terminal 4.
3. Solder finish uncontrolled in this area.
4. Dimension (without solder).
5. Add typically 0.002 inches (0.05mm) for solder plating.
6. L₁ is the terminal length for soldering.
7. Position of lead to be measured 0.120 inches (3.05mm)
from bottom of dimension D.
8. Controlling dimension: Inch.
9. Revision 10 dated 5-99.
TO-263AB
24mm TAPE REEL
1.5mm
DIA. HOLE
4.0mm
USER DIRECTION OF FEED
2.0mm
1.75mm
CL
24mm
©2001 Fairchild Semiconductor Corporation
16mm
COVER TAPE
GENERAL INFORMATION
1. 800 PIECES PER REEL.
2. ORDER IN MULTIPLES OF FULL REELS ONLY.
3. MEETS EIA-481 REVISION "A" SPECIFICATIONS.
40mm MIN.
ACCESS HOLE
30.4mm
330mm
13mm
100mm
24.4mm
FGH30N6S2 / FGP30N6S2 / FGS30N6S2 Rev. A