FGH30N6S2_01 Datasheet, PDF (10/11 Pages) Fairchild Semiconductor – 600V, SMPS II Series N-Channel IGBT

TO-220AB
3 LEAD JEDEC TO-220AB PLASTIC PACKAGE
ØP
Q
D
E₁
L₁
L
60^o
E
H₁
D₁
b₁
b
123
e
e₁
A
45^o
c
J₁
A₁
TERM. 4
INCHES
MILLIMETERS
SYMBOL
MIN
MAX
MIN
MAX
NOTES
A
0.170
0.180
4.32
4.57
-
A₁
0.048
0.052
1.22
1.32
-
b
0.030
0.034
0.77
0.86
3, 4
b₁
0.045
0.055
1.15
1.39
2, 3
c
0.014
0.019
0.36
0.48
2, 3, 4
D
0.590
0.610
14.99
15.49
-
D₁
-
0.160
-
4.06
-
E
0.395
0.410
10.04
10.41
-
E₁
-
0.030
-
0.76
-
e
0.100 TYP
2.54 TYP
5
e₁
0.200 BSC
5.08 BSC
5
H₁
0.235
0.255
5.97
6.47
-
J₁
0.100
0.110
2.54
2.79
6
L
0.530
0.550
13.47
13.97
-
L₁
0.130
0.150
3.31
3.81
2
ØP
0.149
0.153
3.79
3.88
-
Q
0.102
0.112
2.60
2.84
-
NOTES:
1. These dimensions are within allowable dimensions of Rev. J of JEDEC TO-
220AB outline dated 3-24-87.
2. Lead dimension and finish uncontrolled in L₁.
3. Lead dimension (without solder).
4. Add typically 0.002 inches (0.05mm) for solder coating.
5. Position of lead to be measured 0.250 inches (6.35mm) from bottom of dimen-
sion D.
6. Position of lead to be measured 0.100 inches (2.54mm) from bottom of dimen-
sion D.
7. Controlling dimension: Inch.
8. Revision 2 dated 7-97.
©2001 Fairchild Semiconductor Corporation
FGH30N6S2 / FGP30N6S2 / FGS30N6S2 Rev. A