FGH30N6S2_01 Datasheet, PDF (8/11 Pages) Fairchild Semiconductor – 600V, SMPS II Series N-Channel IGBT

TO-247
3 LEAD JEDEC STYLE TO-247 PLASTIC PACKAGE
E
ØR
D
A
Q
TERM. 4
ØS ØP
L₁
L
b₁
b₂
c
b
1
2
3
e
J₁
e₁
3
2
1
BACK VIEW
INCHES
MILLIMETERS
SYMBOL
MIN
MAX
MIN
MAX
NOTES
A
0.180
0.190
4.58
4.82
-
b
0.046
0.051
1.17
1.29
2, 3
b₁
0.060
0.070
1.53
1.77
1, 2
b₂
0.095
0.105
2.42
2.66
1, 2
c
0.020
0.026
0.51
0.66
1, 2, 3
D
0.800
0.820
20.32
20.82
-
E
0.605
0.625
15.37
15.87
-
e
0.219 TYP
5.56 TYP
4
e₁
0.438 BSC
11.12 BSC
4
J₁
0.090
0.105
2.29
2.66
5
L
0.620
0.640
15.75
16.25
-
L₁
0.145
0.155
3.69
3.93
1
ØP
0.138
0.144
3.51
3.65
-
Q
0.210
0.220
5.34
5.58
-
ØR
0.195
0.205
4.96
5.20
-
ØS
0.260
0.270
6.61
6.85
-
NOTES:
1. Lead dimension and finish uncontrolled in L₁.
2. Lead dimension (without solder).
3. Add typically 0.002 inches (0.05mm) for solder coating.
4. Position of lead to be measured 0.250 inches (6.35mm) from bottom of dimen-
sion D.
5. Position of lead to be measured 0.100 inches (2.54mm) from bottom of dimen-
sion D.
6. Controlling dimension: Inch.
7. Revision 1 dated 1-93.
©2001 Fairchild Semiconductor Corporation
FGH30N6S2 / FGP30N6S2 / FGS30N6S2 Rev. A