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FXMHD103UMX Datasheet, PDF (6/16 Pages) Fairchild Semiconductor – FXMHD103 HDMI Voltage Translator
Thermal Properties
Junction-to-ambient thermal resistance is a function of application and board layout. This data is measured with four-
layer 2s2p boards in accordance to JEDEC standard JESD51. Special attention must be paid not to exceed junction
temperature TJ (maximum) at a given ambient temperature.
Symbol Parameter
ΘJA Junction-to-Ambient Thermal Resistance
Typ. Unit
320 °C/W
DC Electrical Characteristics (ICC)
Unless otherwise specified, TA=-40 to 85°C.
Symbol Parameter
Condition
Min. Typ. Max. Unit
ICCPD1 Power Down 1
VCCA=0V, or VCCC=0V, All Other Pins=Don’t Care
1
μA
ICCPD2
ICCHPD
ICCA
ICCC
Power Down 2
Active HPD Only
Active HDMI Link
OE=LOW, VCCA and VCCC Valid, All Other
Pins=Don’t Care
OE=HIGH, VCCA and VCCC Valid, SCL_H,
SDA_H and CEC_H=HIGH, HPD_C=0V
VCCA and VCCC Valid, SCL_H, SDA_H and
CEC_H=HIGH, HPD_C=VCCC, OE=HIGH
VCCA and VCCC Valid, SCL_H, SDA_H and
CEC_H=HIGH, HPD_C=VCCC, OE=HIGH
1
µA
1.5
µA
5
µA
5
µA
Back Drive Current
Unless otherwise specified, TA=-40 to 85°C.
Symbol
IbackCEC
IbackDDC
IbackVCCC
IbackHPD
Parameter
Current Through CEC_C
Current Through SDA_C
and SCL_C
Current Through VCCC
Current Through HPD_C
Condition
CEC_C=0V - 5V
SDA_C and SCL_C=0V – 5V
VCCC=0V – 5V
HPD_C=0V – 5V
VCCA
0V
0V
0V
0V
VCCC
0V
0V
NA
0V
Typ.
0.1
0.1
0.1
0.1
Max.
1.8
5.0
5.0
5.0
Unit
µA
µA
µA
µA
© 2012 Fairchild Semiconductor Corporation
FXMHD103 • Rev. 1.0.2
6
www.fairchildsemi.com