FAN2564_11 Datasheet, PDF (4/13 Pages) Fairchild Semiconductor – 300mA Low VIN LDO for Digital Applications

Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be oper-
able above the recommended operating conditions and stressing the parts to these levels is not recommended. In
addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Symbol
V_IN
T_J
T_STG
T_L
ESD
Parameter
Input Voltage with Respect to GND
Voltage on Any Other Pin with Respect to GND
Junction Temperature
Storage Temperature
Lead Temperature (Soldering 10 Seconds)
Electrostatic Discharge
Protection Level
Human Body Model per JESD22-A114
Charged Device Model per JESD22-C101
Machine Model per JESD22-A115
Min.
-0.3
-0.3
-40
-65
4
2
200
Max.
4.5
V_IN
+150
+150
+260
Unit
V
V
°C
°C
°C
kV
V
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to Absolute Maximum Ratings.
Symbol
V_CC
I_OUT
C_IN
C_OUT
T_A
T_J
Parameter
Supply Voltage Range
Output Current
Input Capacitor
Output Capacitor
Operating Ambient Temperature
Operating Junction Temperature
Min.
1.8
0
1.0
-40
-40
Typ.
1.0
4.7
Max.
3.6
300
10.0
+85
+125
Unit
V
mA
µF
µF
°C
°C
Thermal Properties
Symbol Parameter
Min. Typ. Max. Units
Θ_JA
Junction-to-Ambient Thermal Resistance⁽²⁾
WLSCP
200
°C/W
UMLP
49
°C/W
Note:
2. Junction-to-ambient thermal resistance is a function of application and board layout. This data is measured
with four-layer 2s2p boards in accordance to JESD51- JEDEC standard. Special attention must be paid not to
exceed junction temperature T_J(max) at a given ambient temperate T_A.
© 2007 Fairchild Semiconductor Corporation
FAN2564 • Rev. 1.0.2
4
www.fairchildsemi.com