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| FAN2564_11 Datasheet, PDF (10/13 Pages) Fairchild Semiconductor – 300mA Low VIN LDO for Digital Applications | |||
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Layout Considerations
CIN and COUT should be placed close to the device for
optimal transient response and device behavior. A dedi-
cated ground plane is recommended for proper GND
connection.
Figure 23. Assembly Diagram
Figure 25. Bottom Layer
Figure 24. Top Layer
© 2007 Fairchild Semiconductor Corporation
FAN2564 ⢠Rev. 1.0.2
10
www.fairchildsemi.com
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