FAN3216_12 Datasheet, PDF (2/18 Pages) Fairchild Semiconductor – Dual-2A, High-Speed, Low-Side Gate Drivers

Package Outline
Figure 2. SOIC-8 (Top View)
Thermal Characteristics⁽¹⁾
Package
8-Pin Small Outline Integrated Circuit (SOIC)
_JL(2)
40
_JT(3)
31
_JA(4)
89
_JB(5)
43
_JT(6)
3.0
Units
°C/W
Notes:
1. Estimates derived from thermal simulation; actual values depend on the application.
2. Theta_JL (_JL): Thermal resistance between the semiconductor junction and the bottom surface of all the leads (including any
thermal pad) that are typically soldered to a PCB.
3. Theta_JT (_JT): Thermal resistance between the semiconductor junction and the top surface of the package, assuming it is
held at a uniform temperature by a top-side heatsink.
4. Theta_JA (ΘJA): Thermal resistance between junction and ambient, dependent on the PCB design, heat sinking, and airflow.
The value given is for natural convection with no heatsink using a 2S2P board, as specified in JEDEC standards JESD51-2,
JESD51-5, and JESD51-7, as appropriate.
5. Psi_JB (_JB): Thermal characterization parameter providing correlation between semiconductor junction temperature and an
application circuit board reference point for the thermal environment defined in Note 4. For the SOIC-8 package, the board
reference is defined as the PCB copper adjacent to pin 6.
6. Psi_JT (JT): Thermal characterization parameter providing correlation between the semiconductor junction temperature and
the center of the top of the package for the thermal environment defined in Note 4.
© 2012 Fairchild Semiconductor Corporation
FAN3216 / FAN3217_F085 • Rev. 1.0.0
2
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