XR16L2550IM-F Datasheet, PDF (34/44 Pages) Exar Corporation – LOW VOLTAGE DUART WITH 16-BYTE FIFO

XR16L2550
LOW VOLTAGE DUART WITH 16-BYTE FIFO
ABSOLUTE MAXIMUM RATINGS
Power Supply Range
Voltage at Any Pin
Operating Temperature
Storage Temperature
Package Dissipation
7 Volts
GND-0.3 V to +5.5 V
-40^o to +85^oC
-65^o to +150^oC
500 mW
REV. 1.1.3
TYPICAL PACKAGE THERMAL RESISTANCE DATA (MARGIN OF ERROR: ± 15%)
Thermal Resistance (48-TQFP)
theta-ja =59^oC/W, theta-jc = 16^oC/W
Thermal Resistance (44-PLCC)
theta-ja = 50^oC/W, theta-jc = 21^oC/W
Thermal Resistance (32-QFN)
theta-ja = ^oC/W, theta-jc = ^oC/W
ELECTRICAL CHARACTERISTICS
DC ELECTRICAL CHARACTERISTICS
UNLESS OTHERWISE NOTED: TA=-40^O TO +85^OC, VCC IS 2.25 TO 5.5V
SYMBOL
PARAMETER
2.5V LIMITS
MIN
MAX
3.3V LIMITS
MIN
MAX
V_ILCK Clock Input Low Level
-0.3 0.2 -0.3 0.6
V_IHCK
V_IL
V_IH
V_OL
Clock Input High Level
Input Low Voltage
Input High Voltage
Output Low Voltage
2.0
5.5
2.4
5.5
-0.3 0.6 -0.3 0.8
2.0
5.5
2.0
5.5
0.4
0.4
V_OH Output High Voltage
2.0
1.8
I_IL
Input Low Leakage Current
±10
±10
I_IH
Input High Leakage Current
±10
±10
C_IN Input Pin Capacitance
5
5
I_CC Power Supply Current
1
1.3
I_SLEEP Sleep Current
6
15
5.0V LIMITS
MIN
MAX
-0.5 0.6
UNITS
V
CONDITIONS
3.0
5.5
V
-0.5 0.8
V
2.2
5.5
V
0.4
V I_OL = 6 mA
V I_OL = 4 mA
V I_OL = 2 mA
2.4
V I_OH = -6 mA
V I_OH = -1 mA
V I_OH = -400 uA
±10 uA
±10 uA
5
pF
3
mA
30
uA See Test 1
Test 1: The following inputs must remain steady at VCC or GND state to minimize Sleep current: A0-A2, D0-
D7, IOR#, IOW#, CSA#, CSB#, and all modem inputs. Also, RXA and RXB inputs must idle at logic 1 state
while asleep. Floating inputs will result in sleep currents in the mA range. For PowerSave feature that isolates
address, data and control signals, please see the XR16L2551 datasheet.
34