M02139 Datasheet, PDF (7/18 Pages) M/A-COM Technology Solutions, Inc. – 1G/10G Gbps TIA with AGC and Rate Select

2.0 Pad Definitions
Figure 2-1. Bare Die Layout
2
1
14
13
12 11
VCC
AGC DOUT NC
GND
3 _PINK
4 PINA
VCC
MON DOUT
NC
5
6
7
8
GND
9 10
Table 2-1. Pad Descriptions
Die Pad #
Name
Function
1
AGC
Monitor or force AGC voltage.
2
V_CC
Power pin. Connect to most positive supply.
3
PINK
Common PIN input. Connect to photo diode cathode.⁽¹⁾
4
PINA
Active PIN input. Connect to photo diode anode.
5
V_CC
Power pin. Connect to most positive supply.
6
MON
Analog current source output and rate selection function input pin. Current matched to average photodiode
current. If externally biasing the photodiode cathode the MON can be used for rate selection function only.
See Section 3.2.4 for detailed information.
7
DOUT
Differential data output (goes low as light increases).
8,13
9,10,11, 12
NC
No Connect. Leave floating.
GND
Ground pin. Connect to the most negative supply ⁽²⁾.
14
DOUT
Differential data output (goes high as light increases).
NA
Backside Backside. Connect to the lowest potential, usually ground.
NOTES:Notes:
1. Alternatively the photodiode cathode may be connected to a decoupled positive supply, e.g. V_CC.
2. All ground pads are common on the die. Only one ground pad needs to be connected to the TO-Can ground. However, connecting more than one
ground pad to the TO-Can ground, particularly those across the die from each other can improve performance in noisy environments.
02139-DSH-001-D
Mindspeed Technologies^®
7
Mindspeed Proprietary and Confidential