M02139 Datasheet, PDF (2/18 Pages) M/A-COM Technology Solutions, Inc. – 1G/10G Gbps TIA with AGC and Rate Select

Ordering Information
Part Number
M02139-13
M02139-23
M02139-33
Package
Waffle Pack
Sawn Quartered Wafer
Expanded whole wafer on a ring
Operating Temperature
–40 °C to 95 °C
–40 °C to 95 °C
–40 °C to 95 °C
Revision History
Revision
Level
D
Release
C
Preliminary
B
Preliminary
A
Preliminary
Date
August 2011
March 2011
August 2010
April 2010
Description
Added 10G specifications. Added final specifications.
Removed 10G support and added lower data rate sensitivity performance.
Revised ordering information details.
Corrected Figure 3-2 and other text edits.
Initial release.
Typical Eye Diagram
Pad Configuration
2
1
14
13
12 11
VCC
AGC DOUT NC
GND
3 _PINK
10.3 Gbps, -15 dBm, 20 mV/div, 16 ps/div
4 PINA
VCC
MON DOUT
NC
5
6
7
8
GND
9 10
Die size ≈ 1242 x 932 µm
02139-DSH-001-D
Mindspeed Technologies^®
2
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