M02139 Datasheet, PDF (13/18 Pages) M/A-COM Technology Solutions, Inc. – 1G/10G Gbps TIA with AGC and Rate Select

Applications Information
4.4
T0-Can Assembly Recommendations
Figure 4-3. TO-Can Assembly Diagram
This bond is
unreliable
NOT Recommended Example
PIN Diode
This bond is too
long and
unreliable
M02139
Ceramic Shim
Submount
TO-CAN Header
TO Can Leads
@4 or 5
Recommended Example
M02139
PIN Diode
Metal Shim
Ceramic Shim
Submount
TO-CAN Header
TO Can Leads
@4 or 5
02139-DSH-001-D
Mindspeed Technologies^®
13
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