M02139 Datasheet, PDF (12/18 Pages) M/A-COM Technology Solutions, Inc. – 1G/10G Gbps TIA with AGC and Rate Select

Applications Information
4.2
TO-Can Layout
Figure 4-2. Typical Layout Diagram with Photodiode Mounted on Metallized Shim or TO-Can Base (5 pin TO-Can)
DOUT
M02139
DOUTB
VCC
Shim
MON
NOTES:
Typical application inside of a 5 lead TO-Can.
It is only necessary to bond one V_CC pad and one GND pad. However, bonding both GND pads is encouraged for improved performance in noisy
environments.
The backside must be connected to the lowest potential, usually ground, with conductive epoxy or a similar die attach material. If a monitor output is
not required then a 4 lead TO-Can may be used.
4.3
Treatment of PINK
PINK does not require capacitor bypassing regardless of whether or not it is used to bias the photo diode.
02139-DSH-001-D
Mindspeed Technologies^®
12
Mindspeed Proprietary and Confidential