FX15SC-51S-0.5SV Datasheet, PDF (19/24 Pages) List of Unclassifed Manufacturers – 1mm Pitch Cable-to-Board Connectors supporting LVDS signal

The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
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xPlug – micro-coaxial cable
Precautions and recommendations
[ Coutions for soldring ]
1. For the micro coaxial cable assembled to this connector, cable alignment process as shown in "Recommended cable" on the page 1 is required
before assembly.
1Width of ground bar shall be 1.05 mm Max. including misalignment of overlapping, flush by cutting, side drop or soldering.
Using an inadequate cable will interfere the assembly to the connector. Forceful assembly and soldering could cause mis-soldering to defective
product.
2Minimize the length of outer conductor beyond the ground the bar.
3Length of cutting the extra cable shall be 2.1 mm Max.
Its over length will cause the cable touching the connector body
during assembly and cause defective product.
Minimal length 2.0 mm is a recommended dimension and allowed
to be changed if necessary, as long as ensuring good solderability.
Inner conductor
rSolder coating
Grounding bar
4Pre-solder and coat the inner conductor at the cable end.
Outer conductor
2. Recommended solder for the assembly is flux cored solder with 0.2
mm dia. (Lead-free: Sn-3Ag-0.5Cu), 21 mm length.
If you consider using additional flux, please pay enough attention not
to have flux wicking to the contact area.
Flux wicking to the contact area will cause contact failure.
3. Place the cable to the connector and check the below points before
soldering by cable assembly machine.
1Misalinment of cable end to the terminals in pitch direction
2Excessive floating of cable end
4. Follow the recommended temperature profile shown below for the
soldering.
qMisalignment in pitch direction
wfloating
However, the optimum condition could vary depending on various including type of cable and its length, solder type. Therefore refer to the
recommended temperature profile and optimize the condition if necessary.
Solder tip
pressurization
13~17N
Heating
Temperature 265±5ç
Duration
3~4 sec
265ç
250ç
Pre-heating
Heating
Idling 50ç
2s 1s 2s
3-4s
Duration of pressure application
220ç
B291