FX15SC-51S-0.5SV Datasheet, PDF (16/24 Pages) List of Unclassifed Manufacturers – 1mm Pitch Cable-to-Board Connectors supporting LVDS signal

The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoH_FS _Xpr₁od₅uc_Sts_erh_ia_eve_sb_qee₁n_mdis_mcon_Pti_in_tu_ced_h, o_Cr _awi_bll _lb_ee_-d_ti_osc_-o_Bnt_oin_aue_rd_dso_Con_o._nPl_nea_es_ce _tc_ohe_rc_sk t_she_uppr_pod_ou_rc_tt_is_ns_gtat_Lus_Vo_Dn t_She_sH_iir_go_nse_aw_lebsite RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
BRecommended temperature profile
MAX 250ç
250
230
230ç
180ç
180
150
150ç
100
25
0
90±30sec.
30±10sec.
Time (sec.)
Preheating(150 to 180ç) Sodering
(230çmin)
Note: The temperature profile indicates the maximum temperature
of the connector surfaces at the highest point from the PCB
mounting surface.
HRS test conditions
Test boardGlass epoxy 40mm∞30mm∞1mm thick
Solder method
:Reflow
Solder composition :Paste,
96.5%Sn/3%Ag/0.5%Cu
Metal mask
: 0.12mm thick
Reflow cycles
: 2 cycles
The temperature profile is based on the above
conditions.
In individual applications the actual temperature may
vary, depending on solder paste type,
volume/thickness and board size/thickness. Consult
your solder paste and equipment manufacturer for
specific recommendations.
BCleaning recommendations
Organic solvent cleaning
Solvent type
IPA (Isoporopyl alcohol)
HCFC (Hydrochlorofluorocarbon)
Room temperature cleaning
YES
YES
Heated cleaning
YES
YES
Water based cleaning
When using water based cleaning agents (e.g., terpene, alkali saponifiers), select the cleaning agent based on the documentation
issued by the various manufacturers of cleaning agents which describes it’s affects on metals, platings and plastics. Remove any
moisture after cleaning. Residual flux or cleaning agents in the contact areas may affect electrical performance.
B288