|
AT45DQ161 Datasheet, PDF (1/81 Pages) List of Unclassifed Manufacturers – 16-Mbit DataFlash (with Extra 512-Kbits), 2.3V or 2.5V Minimum SPI Serial Flash Memory with Dual-I/O and Quad-I/O Support | |||
|
AT45DQ161
16-Mbit DataFlash (with Extra 512-Kbits), 2.3V or 2.5V Minimum
SPI Serial Flash Memory with Dual-I/O and Quad-I/O Support
Features
PRELIMINARY DATASHEET
ï¬ Single 2.3V - 3.6V or 2.5V - 3.6V supply
ï¬ Serial Peripheral Interface (SPI) compatible
ï¬ Supports SPI modes 0 and 3
ï¬ Supports RapidS⢠operation
ï¬ Supports Dual-input and Quad-input Buffer Write
ï¬ Supports Dual-output and Quad-output Read
ï¬ Very high operating frequencies
ï¬ 85MHz (for SPI)
ï¬ 85MHz (for Dual-I/O and Quad-I/O)
ï¬ Clock-to-output time (tV) of 6ns maximum
ï¬ User configurable page size
ï¬ 512 bytes per page
ï¬ 528 bytes per page (default)
ï¬ Page size can be factory pre-configured for 512 bytes
ï¬ Two fully independent SRAM data buffers (512/528 bytes)
ï¬ Allows receiving data while reprogramming the main memory array
ï¬ Flexible programming options
ï¬ Byte/Page Program (1 to 512/528 bytes) directly into main memory
ï¬ Buffer Write
ï¬ Buffer to Main Memory Page Program
ï¬ Flexible erase options
ï¬ Page Erase (512/528 bytes), Block Erase (4KB)
ï¬ Sector Erase (128KB), Chip Erase (16-Mbits)
ï¬ Program and Erase Suspend/Resume
ï¬ Advanced hardware and software data protection features
ï¬ Individual sector protection
ï¬ Individual sector lockdown to make any sector permanently read-only
ï¬ 128-byte, One-Time Programmable (OTP) Security Register
ï¬ 64 bytes factory programmed with a unique identifier
ï¬ 64 bytes user programmable
ï¬ Hardware and software controlled reset options
ï¬ JEDEC Standard Manufacturer and Device ID Read
ï¬ Low-power dissipation
ï¬ 500nA Ultra-Deep Power-Down current (typical)
ï¬ 3µA Deep Power-Down current (typical)
ï¬ 25µA Standby current (typical)
ï¬ 11mA Active Read current (typical at 20MHz)
ï¬ Endurance: 100,000 program/erase cycles per page minimum (50,000 cycles
for extended temperature option)
ï¬ Data retention: 20 years
ï¬ Complies with full industrial temperature range (extended temperature optional)
ï¬ Green (Pb/Halide-free/RoHS compliant) packaging options
ï¬ 8-lead SOIC (0.150" wide and 0.208" wide)
ï¬ 8-pad Ultra-thin DFN (5 x 6 x 0.6mm)
ï¬ 9-ball Ultra-thin UBGA (6 x 6 x 0.6mm)
8790BâDFLASHâ10/2013
|
▷ |