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NT256D64S88B1G Datasheet, PDF (21/28 Pages) List of Unclassifed Manufacturers – 184 pin Unbuffered DDR DIMM
NT512D64S8HB1G / NT512D64S8HB1GY / NT512D64S8HB0G
NT256D64S88B1G / NT256D64S88B1GY NT256D64S88B0G
NT128D64SH4B1G / NT512D72S8PB0G (ECC) / NT256D72S89B0G (ECC)
Unbuffered DDR DIMM
AC Timing Specifications for DDR SDRAM Devices Used on Module
TA = 0 °C ~ 70 °C; VDDQ= VDD= 2.5V ± 0.2V (PC2100/PC2700); VDDQ= VDD= 2.6V ± 0.1V (PC3200) (Part 2 of 2)
Symbol
Parameter
Address and control input setup time
tIS
(slow slew rate)
5T
PC3200
Min. Max.
0.7
6K
PC2700
Min. Max.
0.8
75B
PC2100
Min. Max.
1.0
Unit Notes
2-4,
ns 10-12,
14
tIPW
Input pulse width
2.2
2.2
2.2
ns 2-4, 12
tRP RE
tRP ST
tRAS
Read preamble
Read postamble
Active to Precharge command
0.9
1.1
0.9
1.1
0.9
1.1
tCK
1-4
0.40
0.60
0.40
0.60
0.40
0.60
tCK
1-4
42ns 120us 42ns 120us 45ns 120us
1-4
tRC
Active to Active/Auto-refresh command period
55
60
65
ns
1-4
Auto-refresh to Active/Auto-refresh command
tRFC
70
72
75
ns
1-4
period
tRCD Active to Read or Write delay
15
18
20
ns
1-4
tRAP Active to Read Command with Auto-precharge
15
18
20
ns
1-4
tRP
Precharge command period
15
18
20
ns
1-4
tRRD Active bank A to Active bank B command
10
12
15
ns
1-4
tWR
Write recovery time
15
(tWR/
tDAL
Auto-precharge write recovery + precharge time
tCK ) +
(tRP /
tCK )
tWTR Internal write to read command delay
1
15
(tWR/
tCK ) +
(tRP /
tCK )
1
15
(tWR/
tCK ) +
(tRP /
tCK )
1
ns
1-4
tCK 1-4, 13
tCK
1-4
tPDEX Power down exit time
5
6
7.5
ns
1-4
tXSNR Exit self-refresh to non-read command
75
75
75
ns
1-4
tXSRD
tREFI
Exit self-refresh to read command
Average Periodic Refresh Interval
200
200
200
tCK
1-4
7.8
7.8
7.8
µs 1-4, 8
REV 2.2
Aug 3, 2004
Preliminary
21
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