88E1111 Datasheet, PDF (192/252 Pages) List of Unclassifed Manufacturers – Integrated 10/100/1000 Ultra Gigabit Ethernet Transceiver

88E1111
Integrated 10/100/1000 Ultra Gigabit Ethernet Transceiver
4.3.2 Thermal Conditions for 96-Pin BCC Package
Symbol
θ_JA
ψ_JT
Parameter
Thermal resistance - junc-
tion to
ambient of the 88E1111
device 96-Pin BCC package
θ_JA = (T_J - T_A)/ P
P = Total Power Dissipation
Thermal characteristic
parameter¹ - junction to top
center of the 88E1111 device
96-Pin BCC package
Condition
JEDEC 3 in. x 4.5 in. 4-layer
PCB with no air flow
JEDEC 3 in. x 4.5 in. 4-layer
PCB with 1 meter/sec air flow
JEDEC 3 in. x 4.5 in. 4-layer
PCB with 2 meter/sec air flow
JEDEC 3 in. x 4.5 in. 4-layer
PCB with no air flow
Min
Typ
25.00
Max
Units
°C/W
23.60
°C/W
20.90
°C/W
1.3
°C/W
ψ_JT = (T_J - T_c)/P.
P = Total Power Dissipation
θ_JC
Thermal resistance¹ - junc-
JEDEC with no air flow
tion to case of the 88E1111
device
96-Pin BCC package
20.50
°C/W
θ_JC = (T_J - T_C)/ P_Top
P_Top = Power Dissipation
from the top of the package
θ_JB
Thermal resistance¹ - junc-
JEDEC with no air flow
tion to board of the 88E1111
device 96-Pin BCC package
9.60
°C/W
θ_JB = (T_J - T_B)/ P_bottom
P_bottom = power dissipation
from the bottom of the pack-
age to the PCB surface.
1. Refer to white paper on TJ Thermal Calculations for more information.
Doc. No. MV-S100649-00, Rev. E
Page 192
CONFIDENTIAL
Document Classification: Proprietary Information
Copyright © 2004 Marvell
November 19, 2004, Advance