56F8357 Datasheet, PDF (134/172 Pages) List of Unclassifed Manufacturers – 16-BIT HYBRID CONTROLLERS

Table 10-2 56F8357/56F8157 ElectroStatic Discharge (ESD) Protection
Characteristic
Min
Typ
Max
Unit
ESD for Human Body Model (HBM)
2000
—
—
V
ESD for Machine Model (MM)
200
—
—
V
ESD for Charge Device Model (CDM)
500
—
—
V
Characteristic
Junction to ambient
Natural convection
Junction to ambient (@1m/sec)
Junction to ambient
Natural convection
Junction to ambient (@1m/sec)
Junction to case
Junction to center of case
I/O pin power dissipation
Power dissipation
Maximum allowed P_D
Table 10-3 Thermal Characteristics⁶
Comments
Symbol
R_θJA
Value
160-pin LQFP
38.5
Unit Notes
°C/W 2
Four layer board (2s2p)
Four layer board (2s2p)
R_θJMA
R_θJMA
(2s2p)
R_θJMA
R_θJC
Ψ_JT
P _I/O
P_D
P_DMAX
35.4
°C/W 2
33
°C/W 1,2
31.5
°C/W 1,2
8.6
°C/W 3
0.8
°C/W 4, 5
User-determined
W
P _D = (I_DD x V_DD + P _I/O)
W
(TJ - TA) / θJA
°C
1. Theta-JA determined on 2s2p test boards is frequently lower than would be observed in an application. Determined on 2s2p ther-
mal test board.
2. Junction to ambient thermal resistance, Theta-JA (R_θJA) was simulated to be equivalent to the JEDEC specification JESD51-2
in a horizontal configuration in natural convection. Theta-JA was also simulated on a thermal test board with two internal planes
(2s2p where “s” is the number of signal layers and “p” is the number of planes) per JESD51-6 and JESD51-7. The correct name
for Theta-JA for forced convection or with the non-single layer boards is Theta-JMA.
3. Junction to case thermal resistance, Theta-JC (R_θJC ), was simulated to be equivalent to the measured values using the cold
plate technique with the cold plate temperature used as the "case" temperature. The basic cold plate measurement technique is
described by MIL-STD 883D, Method 1012.1. This is the correct thermal metric to use to calculate thermal performance when
the package is being used with a heat sink.
4. Thermal Characterization Parameter, Psi-JT (Ψ_JT ), is the "resistance" from junction to reference point thermocouple on top cen-
ter of case as defined in JESD51-2. Ψ_JT is a useful value to use to estimate junction temperature in steady state customer envi-
ronments.
5. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature,
ambient temperature, air flow, power dissipaion of other components on the board, and board thermal resistance.
6. See Part 12.1 for more details on thermal design considerations.
56F8357 Technical Data, Rev. 8.0
134
Freescale Semiconductor
Preliminary