PT8R1202 Datasheet, PDF (10/26 Pages) List of Unclassifed Manufacturers – Bluetooth Digital Audio Streaming IC

Data Sheet
PT8R1202
PT Pericom Technology Inc.
Bluetooth Digital Audio Streaming IC
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Package Diagram of FPBGA
Notes :
1. All dimension are in millimeters.
2. ‘e’ represents the basic solder ball grid pitch.
3. ‘M’ represents the basic solder ball matrix size.
And, symbol ‘N’ is the number of balls after depopulating.
4. ‘b’ is measurable at the maximum solder ball diameter after
reflow parallel to primary datum -c-.
5. Dimension ‘aaa’ is measured parallel to primary datum –c-.
6. Primary datum –c- and seating plane are defined by the spherical
crowns of the solder balls.
7. Package surface shall be matte finish charmilles 24 to 27.
8. Package centering to substrate shall be 0.0760 mm maximum
for both X and Y direction respectively.
9. Package warp shall be 0.050mm maximum.
10. Substrate material base is bt resin.
11. The overall package thickness “A” already considers collapse balls.
12. Dimension and tolerancing per ASME Y14.5-1994.
PT0137(08/04)
10
Ver:4