EPC110 Datasheet, PDF (24/27 Pages) Espros Photonics corp – Fully integrated configurable light barrier driver & receiver

Layout Information (all measures in mm,
CSP-10 Package
1.9 +0.0/-0.1
Bottom View ^{∅ 0.12}
File: Unben annt
Part Name
<Partname>
)
Designed
Approved
Scale
Page
<Na m e>
<Na m e>
M 1:1
1
Part No.
<x000 000>
26.02.2009
<Data>
DIN A4
∅ 0.3
epc110
0.1524
0.5
0.5
Pin 1
0.15
Solder balls Sn97.5Ag2.5
0.5
0.5
2.5
no solder mask inside this area
Figure 23: CSP10: Mechanical dimensions
Figure 24: CSP10: Layout recommendation
Recommendations for reliable soldering of solder balls:
• Use a pad layout similar as given in Figure 24. Notice that all tracks should go underneath the solder mask area.
• Do not connect any pins direct pin to pin inside of the opening of the solder mask.
• In case of the conductors are with a Au-Ni surface finish the preferred landing pad design for the solder balls will be covering the
round landing pad with a gold surface finish as a solderable area only.
QFN-16 Package
Opening in solder mask
Conductor layout
NC_GND
LED/SCK
EN/SI
NC_GND
<Title>
File:
This document is confidential and_Npr_Cot_{_}ec_Gte_Nd _Dby law and international trades. It must not be shown to any third party nor be copied in any form wit
Top View
GND
PD
NC_GND
1
2
3
4
Shielding of PD pin
© 2011 ESPROS Photonics Corporation
Characteristics subject to change without notice
Figure 25: QFN-16: Layout recommendation
24
Datasheet epc110 - V2.1
www.espros.ch