EN25B64 Datasheet, PDF (1/37 Pages) Eon Silicon Solution Inc. – 64 Megabit Serial Flash Memory with Boot and Parameter Sectors

EN25B64
EN25B64
64 Megabit Serial Flash Memory with Boot and Parameter Sectors
FEATURES
• Single power supply operation
- Full voltage range: 2.7-3.6 volt
• 64 M-bit Serial Flash
- 64 M-bit/8192 K-byte/32768 pages
- 256 bytes per programmable page
• High performance
- 100MHz clock rate
• Low power consumption
- 5 mA typical active current
- 1 μA typical power down current
• Flexible Sector Architecture:
- Two 4-Kbyte, one 8-Kbyte, one 16-Kbyte,one
32-Kbyte, and one hundred twenty-seven 64-
Kbyte sectors
• Software and Hardware Write Protection:
- Write Protect all or portion of memory via
software
- Enable/Disable protection with WP# pin
• High performance program/erase speed
- Byte program time: 7µs typical
- Page program time: 1.5ms typical
- Sector erase time: 300 to 800ms typical
- Chip erase time: 50 Seconds typical
• Lockable 512byte OTP security sector
• Minimum 100K endurance cycle
• Package Options
- 16 pins SOP 300mil body width
- All Pb-free packages are RoHS compliant
• Industrial temperature Range
GENERAL DESCRIPTION
The EN25B64 is a 64M-bit (8192K-byte) Serial Flash memory, with advanced write protection
mechanisms, accessed by a high speed SPI-compatible bus. The memory can be programmed 1 to
256 bytes at a time, using the Page Program instruction.
The EN25B64 has one hundred twenty-eight sectors including one hundred twenty-seven sectors of
64KB, one sector of 32KB, one sector of 16KB, one sector of 8KB and two sectors of 4KB. This device is
designed to allow either single Sector at a time or full chip erase operation. The EN25B64 can protect
boot code stored in the small sectors for either bottom or top boot configurations. The device can sustain
a minimum of 100K program/erase cycles on each sector.
This Data Sheet may be revised by subsequent versions ₁
or modifications due to changes in technical specifications.
©2004 Eon Silicon Solution, Inc., www.essi.com.tw
Rev. C, Issue Date: 2008/06/23